Innovative alloys, like the new tungsten-copper material developed by Sirui New Materials, are emerging to address the intense heat in 400G+ modules. These modules are essential for converting electrical signals into light signals and vice versa, forming the backbone of fiber optic communication systems in data centers. In addition to traditional heat-sinking in packaging of microelectronic dies, more-demanding applications are emerging for copper/tungsten (Cu/W) metal-matrix composites (MMCs) as mounts and submounts for semiconductor laser diodes Some users of conventional Cu/W C-mounts for semiconductor laser. Contrary to injection molding technology, Spectra-Mat's unique technology to infiltrate copper in an highly homogeneous sintered tungsten matrix guarantees the homogeneity of thermal conductivity of the tungsten copper submounts along the three axes, a very important requirement for multi diodes. Density: W-Cu alloys possess a high density, generally between 15-18 grams per cubic centimeter, with the exact value dependent on the tungsten-to-copper ratio. Melting Point: Owing to tungsten's extremely high melting point (3410°C), W-Cu alloys also exhibit a relatively high melting point. Tungsten copper alloys are widely used in military, national defense, aerospace, aviation, navigation, electronic devices, medical equipment, and other fields due to their excellent physical and chemical properties. However, due to the large difference in physical and chemical properties between. For the first time, here we report the assembly of a pyridine-protected tungsten–copper cluster on porous alumina, and find superior optical limiting (OL) properties retainable for multilevel clustering due to unaffected reverse saturable absorption (RSA) and constant photo-excited triplet states.